- stacked multi-chip package
- <el> (e.g. for cell phones) ■ Multichip-Package f
English-german technical dictionary. 2013.
stacked multi-chip package
Schlagen Sie auch in anderen Wörterbüchern nach:
Multi-chip module — POWER5 MCM with four processors and four 36 MB external L3 cache dies on a ceramic multi chip module. A multi chip module (MCM) is a specialized electronic package where multiple integrated circuits (ICs), semiconductor dies or other discrete… … Wikipedia
Multi-Chip Module — A Multi Chip Module (MCM) is a specialized electronic package where multiple integrated circuits (ICs), semiconductor dies or other modules are packaged in such a way as to facilitate their use as a single IC. The MCM itself will often be… … Wikipedia
System in package — A System in a Package or System in Package (SiP), also known as a Chip Stack MCM, is a number of integrated circuits enclosed in a single package or module. The SiP performs all or most of the functions of an electronic system, and are typically… … Wikipedia
Phase-change memory — Computer memory types Volatile RAM DRAM (e.g., DDR SDRAM) SRAM In development T RAM Z RAM TTRAM Historical Delay line memory Selectron tube Williams tube Non volatile … Wikipedia
Dynamic random-access memory — DRAM redirects here. For other uses, see Dram (disambiguation). Computer memory types Volatile RAM DRAM (e.g., DDR SDRAM) SRAM In development T RAM Z RAM TTRAM Historical Delay line memory Selectron tube Williams tube … Wikipedia
Xeon — New Intel Xeon Logo used in 2011 Produced From 1998 to present Common manufacturer(s) … Wikipedia
Thermal copper pillar bump — The Thermal Copper Pillar Bump, also known as the thermal bump , is a thermoelectric device made from thin film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and… … Wikipedia
Integrated circuit packaging — Early USSR made integrated circuit Integrated circuit packaging is the final stage of semiconductor device fabrication per se, followed by IC testing.Packaging in ceramic or plastic prevents physical damage and corrosion and supports the… … Wikipedia
Three-dimensional integrated circuit — In electronics, a three dimensional integrated circuit (3D IC, 3D IC, or 3 D IC) is a chip in which two or more layers of active electronic components are integrated both vertically and horizontally into a single circuit. The semiconductor… … Wikipedia
Texas Instruments OMAP — TI OMAP3530 on BeagleBoard described TI OMAP4430 on PandaBo … Wikipedia
Dynamic random access memory — (DRAM) is a type of random access memory that stores each bit of data in a separate capacitor within an integrated circuit. Since real capacitors leak charge, the information eventually fades unless the capacitor charge is refreshed periodically … Wikipedia
